Jun Ru He

A Hybrid Mean Field Framework for Aggregators Participating in Wholesale Electricity Markets

Jun Ru He, Andrew L. Liu

The rapid growth of distributed energy resources (DERs), including rooftop solar and energy storage, is transforming the grid edge, where distributed technologies and customer-side systems increasingly interact with the broader power grid. DER aggregators, entities that coordinate and optimize the actions of …

Fine Pitch High Density CoWoS-R Package with 1.4/1.4um RDL Lines and 3um via CD

Kathy Yan, Yue Hu, Chien-Hsun Lee, Hsin-Yu Chen et autres

Die-to-die and die-to-HBM fine pitch RDL interconnects are critical to high performance computing (HPC) packaging technology. CoWoS-R is a RDL interposer-based packaging platform, which exhibits low RC interconnect with good signal isolation and design scalability. The technology is currently in production for …

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Integrated Package-to-System Thermal Solution Evolution for High-Performance 2.5D CoWoS-R Advanced Packaging Technology Development

Ting Wu, Kuo‐Chin Chang, Chien-Chang Wang, Bang-Li Wu et autres

2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI systems for the integration of large interposers with SoC chips and HBM cubes. CoWoS-R, a variant with …

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Power Integrity and Circuit Characteristics of Integrated Voltage Regulator (IVR) in CoWoS® Advanced Packaging Technology

Chuei-Tang Wang, Yen‐Ming Chen, Yuhuan Chen, Shu-An Shang et autres

Integrated voltage regulator (IVR) is a highly integrated power management component to provide a new solution for power supply. It can integrate complex driver ICs, high side (HS)/low side (LS) transistor, capacitors, inductors, and other components into a single die, so that …

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Delamination Detection in Composite Materials Using Laser-Generated Lamb Waves with Thickness-Adaptive Wavenumber Filtering and Broadband Scale-Adaptive 2d Wavelet Transform

Zixuan Guo, Jun Ru He, Shixi Yang, Qichao Cheng

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Next Generation Large Size High Interconnect Density CoWoS-R Package

Chien-Hsun Lee, YH Hu, SM Chen, Ching‐Lung Lai et autres

High performance computing (HPC) is essential to applications like big data analysis, artificial intelligence, and cloud computing. Products like autonomous vehicles, edge computing server and data center require high computing speeds, high memory accessing bandwidth and capacity, and high input/output (I/O) bandwidth. …

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An Advanced Packaging Figure of Merit (AP-FoM) for Benchmarking of Heterogeneous Integration Technologies

Chuei-Tang Wang, Shu-An Shang, Yu-Ming Hsiao, Mirng-Ji Lii et autres

A novel advanced packaging figure of merit (AP-FoM) for benchmarking of heterogeneous integration technology performance is proposed in this paper. The AP-FoM is composed of eye width, RC time and jitter in equation of [Eye width / (RC time*Jitter)], related to the …

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Signal and Power Integrity Performance of CoWoS-R in Chiplet Integration Applications

Chuei-Tang Wang, Shu-An Shang, Yu-Ming Hsiao, Kathy Yan et autres

CoWoS-R RDL interposer technology is a key enabling solution to provide low parasitic interconnects between chiplets for high performance computing (HPC) applications. In the study, UCIe IO circuit with data rate up to 32GT/s is implemented on the CoWoS-R technology, the solutions …

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INTEGRATED TECHNOLOGY FOR DETECTION AND REPAIR OF MECHANICAL COMPONENT SURFACE FATIGUE MICROCRACKS USING PULSED LASER

Qichao Cheng, Daming Zhuang, Jun Ru He, Shixi Yang

During processing and service, various types of fatigue microcracks inevitably occur on the surfaces of mechanical components. If the microcrack is not repaired in a timely manner, it will continue to expand, affecting the safety and stability of the equipment. To this …

Analysis of Package-to-System Interaction on Thermal Performance of Large 2.5D Packages Using 3DFabric® Platform

Po-Yao Lin, Chien‐Hung Chen, Kathy Yan, Jun Ru He

With the increasing package size and power consumption of HPC applications, controlling the thermal performance impact from the package-to-system interaction (PSI) in 2.5D/3D chiplet or heterogenous integration packages is crucial for ensuring their long-term reliability in typical operating environments. The present study …

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Investigation of Defect Engineering Toward Prolonged Endurance for HfZrO Based Ferroelectric Device

J.H. Lee, Chen-Han Chou, P. J. Liao, Yu-Kai Chang et autres

This paper reports the defect analyses of interfacial layer (IL) and HfZrO (HZO) stacks from high-endurance ferroelectric (FE) devices. Trap characterization for IL and HZO were evaluated by measuring frequency-dependent capacitance and flicker noise of leakage in IL and HZO respectively accompanied …

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AC TDDB Analysis for HK/IL Gate Stack Breakdown and Frequency-dependent Oxygen Vacancy Trap Generation in Advanced nodes FinFET Devices by SILC Spectrum Methodology

P. S. Chen, Y. W. Lee, Dongsheng Huang, S. C. Chen et autres

Be closer to real product operation, DC TDDB stress convert to AC TDDB could be one choice to wrestle with advanced node shrink limitation. The physical explanation of AC TDDB improvement is successfully interpreted through the analysis of oxide trap generation with …

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