Liao Jinzhi Lois

Application of D 2 O Isotope Tracing Technique for SOC Package Failure Analysis

Liao Jinzhi Lois, Bisheng Wang, Xi Zhang, Lei Zhu et autres

In this study, a System-on-a-chip (SoC) package encountered failure during the Highly Accelerated Stress Test (HAST) test. Delamination was observed between the die and the underfill. It is suspected moisture penetrated through the underfill and substrate interface and caused this delamination during …

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A Study on the Bromine-induced Corrosion/Defects in Wafer Fabrication

Younan Hua, Liao Jinzhi Lois, Liu Binghai, Xiaomin Li

For the semiconductor manufacturing processes, metal corrosion by halogen elements (e.g. fluorine, chlorine, and bromine) is always a critical issue. For the aluminum back-end-of-processes, these halogen elements tend to form aluminum halide defects on the surface of aluminum pads or aluminum metal …

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Application of deuterium Oxide (D2O) Isotope Tracing Technique for Land Grid Array Package Failure Analysis

Liao Jinzhi Lois, Liu Qing, Quan Jing, Qing Ye et autres

A land grid array (LGA) is an integrated circuit design with a grid of contacts connected to other components of a printed circuit board. LGA is used for various high-speed and high-frequency applications due to its small terminal parasitic inductance. However, LGA …

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Failure Analysis & Mechanism Studies of the Worm-like Defects in Vias of Wafer Fabrication

Younan Hua, Liao Jinzhi Lois, Liu Binghai, Zhu Lei et autres

In semiconductor wafer fabrication, the contamination issue by halogens (such as F, Cl, and Br) brings great challenges to metallization processes in the back end of line (BEOL). For aluminum (Al) back-end process, severe metal corrosion may occur by halogens, forming aluminum …

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Study of moisture penetration in chip passivation layer by deuterium oxide (D2O) isotope tracing technique

Liao Jinzhi Lois, Bisheng Wang, Xi Zhang, Younan Hua et autres

Passivation layers normally serve as protection layers to protect the active semiconductor surface from the peripheral environment. They are expected to have good adhesion, corrosion resistance, and moisture resistance. The typical passivation layers are Al2O3, SiO2, Si3N4and AlN. Moisture resistance is one …

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Faster AU-AL IMC Growth Under Chlorine Environment

Liao Jinzhi Lois, Bisheng Wang, Xi Zhang, Younan Hua et autres

Interestingly, this study found that Gold-Aluminum (Au-Al) IMCS grew much faster at the presence of higher content of chlorin (Cl). To the best of the author’s knowledge, there is no study reported on the faster Au-Al IMC growth under Cl environment. It …

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Study of moisture penetration in polymer encapsulant by deuterium oxide (D20) isotope tracing technique

Liao Jinzhi Lois, Bisheng Wang, Xi Zhang, Younan Hua et autres

Polymer encapsulated components are almost universally used in consumable applications over the conventional ceramic or metal electronic packages, due to theirs low cost, easy manufacturing, and processing maturity. However, the polymer encapsulants are non-hermetic. They can absorb moisture from the environment and …

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Chlorine and sulfur effects on copper-aluminum wire bond reliability

Liao Jinzhi Lois, Bisheng Wang, Zhang Xi, Younan Hua et autres

Currently, wire bonding is still the dominant interconnection mode in microelectronic packaging. Copper (Cu) bonding wire is widely used due to its advantages, such as low-cost, good electrical conductivity, etc. However, Cu wire bond is susceptible to galvanic corrosion. There are many …

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Studies of Electron Backscattered Diffraction (EBSD) Analysis Technique and Its Applications in Wafer Fabrication and Advanced Packaging

Younan Hua, Liu Binghai, Liao Jinzhi Lois, Hsieh Chialun et autres

In wafer fabrication and advanced packaging processes, people use failure analysis techniques to characterize thin film materials and get some important information such as grain size distribution and crystal orientation etc. In this paper the authors introduced the electron backscattered diffraction (EBSD) …

Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis

Liao Jinzhi Lois, Yong Du, Qiang Ji, Lei Zhu et autres

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bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al

Liao Jinzhi Lois, Tee Weikok, Yu Minglang, Bisheng Wang et autres

Wire bond is the most common inter-connection method used to connect microchips to the terminals of a chip package. Wire bond reliability is vital to the performance of packaging device. It is vital to understand the reliability performance of different wire types …

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Comprehensive Comparison of the Wire Bond Reliability Performance of CU, PDCU and AG Wires

Liao Jinzhi Lois, Yu Minglang, Tee Weikok, Bisheng Wang et autres

Wire bond is the most common inter-connection method used to connect microchips to the terminals of a chip package. Wire bond reliability is vital to the packaging device performance. The work here investigated and compared the wire bond reliability performances of bare …

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