Study of moisture penetration in polymer encapsulant by deuterium oxide (D20) isotope tracing technique

Le résumé fourni par la source

Polymer encapsulated components are almost universally used in consumable applications over the conventional ceramic or metal electronic packages, due to theirs low cost, easy manufacturing, and processing maturity. However, the polymer encapsulants are non-hermetic. They can absorb moisture from the environment and may lead to failures like corrosion, ion migration, electricity short, etc. of the packages. It is important to know about how fast moisture penetration into the polymer encapsulant. However, so far there is no good method to study the moisture penetration speed in polymer encapsulant. This work applied a new deuterium oxide (D2O) isotope tracing method to study the moisture penetration status of polymer encapsulant. The polymer encapsulated package was loaded into the temperature-humidity chamber with D2O (40°C, 90%RH). Deuterium signal of the samples were subsequently analyzed by Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS). The relationship between moisture penetration distance and time was plotted. The results shows that moisture penetration into polymer encapsulant is about 40um per hour in the current polymer encapsulant in this work.

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