Edem Wornyo

Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies

R. A. Augur, Craig Child, Jung-Joon Ahn, Teck Jung Tang et autres

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Modeling and Optimization of the Deposition of Shape Memory Polymers for Information Storage Applications

Edem Wornyo, G.S. May, Ken Gall

Shape memory polymers are of interest as high-capacity information storage media. This paper seeks to understand the effects of processing conditions on diethylene glycol dimethacrylate (DEGDMA) and bisphenol A ethoxylate dimethacrylate. Full factorial experiments are performed to characterize the impact of the …

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Uses of mobile phones in post-conflict Liberia

Michael L. Best, Edem Wornyo, Thomas N. Smyth, John R. Etherton

Liberia is a country emerging from years of protracted and devastating civil conflict. Left without any fixed line telephone infrastructure, it relies solely on the mobile phone for telephony. This study investigates the usage of mobile phones in this immediate post-conflict setting. …

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Uses of Mobile Phones in Post-Conflict Liberia

Michael L. Best, Edem Wornyo, Thomas N. Smyth, John Etherton

Abstract—Liberia is a country emerging from years of pro-tracted and devastating civil conflict. Left without any fixed line telephone infrastructure, it relies solely on the mobile phone for telephony. This study investigates the usage of mobile phones in this immediate post-conflict setting. …

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Fabrication and characterization of shape memory polymers at small scales

Edem Wornyo

The objective of this research is to thoroughly investigate the shape memory effect \nin polymers, characterize, and optimize these polymers for applications in information storage systems. \n Previous research effort in this field concentrated on shape memory metals for \nbiomedical applications such …

Thickness and Uniformity Modeling of the Deposition of Shape Memory Polymers for Information Storage Applications

Edem Wornyo, Ken Gall, Gary S. May

Shape memory polymers are of interest as high-capacity information storage media. This research seeks to understand the effects of processing conditions on the following candidate polymers: diethylene glycol dimethacrylate (DEGDMA), tertbutyl acrylate (tBA), and bisphenol. Full factorial experiments were performed using three …

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Thermomechanical Formation and Recovery of Nanoindents in a Shape Memory Polymer Studied Using a Heated Tip

Fuzheng Yang, Edem Wornyo, Ken Gall, William P. King

This paper investigates the thermomechanical formation and recovery of nanometer-scale indents in a shape memory polymer (SMP), studied using a heated atomic force microscope (AFM) tip and hot-stage atomic force microscopy. The material tested is a tert-butyl acrylate (tBA)-based polymer, which has …

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Post-conflict communications

Michael L. Best, Kipp Jones, Illenin O. Kondo, Dhanaraj Thakur et autres

article Share on Post-conflict communications: the case of Liberia Authors: Michael L. Best Institute of Technology, Atlanta and Sam Nunn School of International Affairs and the School of Interactive Computing Institute of Technology, Atlanta and Sam Nunn School of International Affairs and …

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Nanoscale indent formation in shape memory polymers using a heated probe tip

Fei Yang, Edem Wornyo, Ken Gall, William P. King

This paper presents experimental investigation of nanoscale indentation formation in shape memory polymers. The polymers were synthesized by photopolymerizing a tert-butyl acrylate (tBA) monomer with a poly(ethylene glycol dimethacrylate) (PEGDMA) crosslinker. The concentration and the molecular weight of the crosslinker were varied …

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Nanoindentation of shape memory polymer networks

Edem Wornyo, Ken Gall, Fuzheng Yang, William P. King

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Effect of crosslinking on the shape recovery of shape memory polymer networks

Edem Wornyo, Ken Gall, Fuzheng Yang, William Henry. King

Shape Memory Capacitors for Next Generation Embedded Actives

Ravi Doraiswami, Edem Wornyo, Swapan Kumar Bhattacharya, Ken Gall

Integral discrete passives occupy nearly 45% of the board real estate. By embedding passives we have the following advantages: improving packaging efficiency & electrical performance, reducing the use of printed wiring board real estate, eliminating assembly to board, minimizing solder joint failure …

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