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Profil bibliographique

Qingqing Sun

Informations fournies par OpenAlex. Research Africa ne déduit ni nationalité, ni poste, ni coordonnées personnelles.

367Publications signalées
8756Citations signalées
5Affiliations récentes

Les institutions déclarées

Les domaines associés

Semiconductor materials and devicesAdvanced Memory and Neural ComputingFerroelectric and Negative Capacitance Devices2D Materials and ApplicationsAdvancements in Semiconductor Devices and Circuit Design

Les publications récentes

2026 article OpenAlex

Reconfigurable Photoelectric Coaxial Fiber-Based Memristors for Neuromorphic Computing

Keying Li, Jieru Song, Le Chen, Y Q He et autres

Bioinspired optoelectronic neuromorphic devices have overcome the limitations of von Neumann architectures. However, most existing devices used in neuromorphic applications are unsuitable for highly flexible, wearable applications. To address this constraint, this work successfully demonstrated a Pt/TiO x /NiO x /Au memristor …

cn (code pays fourni par la source)

1 citation ACS Nano
2026 article OpenAlex

Ni‐Based Metal Cavities‐Mediated Ensemble Effect for Catalytic Hydroconversion of Lignin into Aromatic Monomers

Zhong‐Qiu Liu, Shi‐Qi Jin, Qingqing Sun, Yu‐Jing Liu et autres

An efficient catalytic hydroconversion of lignin into aromatic monomers (AMs) is not only critical for the economic viability of lignin refining, but also reduces dependence on fossil fuels. Nevertheless, current molecular‐level studies on H 2 activation in catalytic hydroconversion of lignin are …

cn (code pays fourni par la source)

0 citations Advanced Synthesis & Catalysis
2026 article OpenAlex

Comparative Degradation Analysis of 1200 V SiC MOSFETs With Different Gate Structures Under High Drain Bias Stress

Peng Liao, Yanghao Wang, Xiaona Ma, Jianbin Guo et autres

Silicon carbide (SiC) MOSFETs are emerging as key components in next-generation electric vehicle powertrains, owing to their superior material properties. However, under automotive harsh conditions such as load dump or inductive shutdown, the device may experience extreme drain voltage stress near or …

cn (code pays fourni par la source)

1 citation IEEE Transactions on Electron Devices
2026 article OpenAlex

Polarity-Dependent Electric Field Modulation via Depletion Region Punchthrough in IGBTs Under Gate-Collector Coupled Stress

Dong Zou, Yanghao Wang, Peng Liao, Xi Chen et autres

Insulated gate bipolar transistors (IGBTs) are subjected to critical combined gate-collector voltage stress under extremeoff-state blocking andon-state saturation conditions, presenting serious reliability challenges. This study identifies a severe degradation mode under such conditions and clarifies its physical origin. Electrical measurements and TCAD …

cn (code pays fourni par la source)

0 citations IEEE Transactions on Electron Devices
2026 article OpenAlex

Statistical Modeling and Prediction of Hot-Carrier Degradation in Nanoscale FinFETs

Xin Xu, Wendi Wei, Xianghui Li, Kun Chen et autres

This work presents a systematic investigation of hot-carrier degradation (HCD) in nanoscale FinFETs using a high-time-resolution HCD_on-the-fly (OTF) characterization technique. Gaussian mixture models (GMMs) combined with the Bayesian information criterion (BIC) are applied to examine the stochastic response of individual traps. By …

cn (code pays fourni par la source)

0 citations IEEE Transactions on Electron Devices
2026 article OpenAlex

Symmetric Phase-Engineered Hf 1-x Zr x O 2 Enabling Reliable Non-Destructive Memory Readout

Binjie Weng, Ke Xu, Yongkai Liu, Jiajie Yu et autres

In response to the new requirements for memory in the era of big data, artificial intelligence, and the Internet of Things, the issue of destructive readout has become particularly critical for ferroelectric memories. In this work, by precisely controlling the atomic doping …

cn (code pays fourni par la source)

0 citations IEEE Electron Device Letters
2026 article OpenAlex

Achieving Enhanced Ferroelectricity and Reliability in HZO/ZrO 2 Superlattices With Back-End-of-Line Process

Xingcan Guo, Ke Xu, Ruihong Yuan, Yongkai Liu et autres

Hafnium -based ferroelectric materials have advanced the development of ferroelectric memory devices owing to their excellent CMOS compatibility and tunable properties. However, hafnium-based ferroelectric capacitors typically require high thermal budgets to achieve strong ferroelectricity, which limits their back-end-of-line (BEOL) compatibility. In this …

cn (code pays fourni par la source)

1 citation IEEE Electron Device Letters

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