Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
Tobias Wernicke, Bernhard Rebhan, Vesa Vuorinen, Mervi Paulasto‐Kröckel et autres
2 citationsECS Journal of Solid State Science and Technology
M. Wiemer
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34Publications signalées
373Citations signalées
0Affiliations récentes
Domaines associés
3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfacesAdvanced MEMS and NEMS TechnologiesIntegrated Circuits and Semiconductor Failure Analysis
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