2025
conference-paper
OpenAlex
Ting‐Yu Chen, Shie-Ping Chang, Bo-Jheng Shih, Zih-Yang Chen et autres
To enable high-density integration, advanced 3D stacking technology implements backside wafer thinning, reducing wafer thickness to$10 \mu \mathrm{m}$. However, this approach imposes constraints on signal routing and via density in bonded structures. This work proposes a novel ultra-thin wafer-level active device transfer …
tw
(code pays fourni par la source)
2025
article
OpenAlex
Bo-Jheng Shih, Zih-Yang Chen, Shie-Ping Chang, Ting-Yu Chen et autres
tw
(code pays fourni par la source)
2024
conference-paper
OpenAlex
Bo-Jheng Shih, Shie-Ping Chang, Ting‐Yu Chen, Zih-Yang Chen et autres
This study introduces a groundbreaking SOI-based temporary bonding technique for 3DIC, resolving significant challenges in thermal management and interlayer alignment. This platform can achieve interlayer thickness below 1 µm, allowing precise visible-light alignment. Integrating advanced bonding, grinding, CMP, and wet etching, it …
tw
(code pays fourni par la source)
Accès ouvert
2024
preprint
OpenAlex
Bo-Jheng Shih, Zih-Yang Chen, Shie-Ping Chang, Ting‐Yu Chen et autres
tw
(code pays fourni par la source)
2019
article
OpenAlex
Chi‐Hsien Huang, Zih-Yang Chen, Chi-Ling Chiu, Tzu‐Ting Huang et autres
Kirigami graphene allows a two-dimensional material to transform into a three-dimensional structure, which constitutes an effective transparent electrode candidate for photovoltaic (PV) cells having a surface texture. The surface texture of an inverted pyramid was fabricated on a Si substrate using photolithography …
tw
(code pays fourni par la source)
2017
dissertation
OpenAlex
陳子揚, 余沛慈, Zih-Yang Chen, Pei-chen Yu
Accès ouvert
2015
article
OpenAlex
Ming‐Jer Jeng, Zih-Yang Chen, Yuling Xiao, Liann‐Be Chang et autres
This work studies the use of gold (Au) and silver (Ag) nanoparticles in multicrystalline silicon (mc-Si) and copper-indium-gallium-diselenide (CIGS) solar cells. Au and Ag nanoparticles are deposited by spin-coating method, which is a simple and low cost process. The random distribution of …
tw, cn, pl, us
(code pays fourni par la source)