Pieter Bex

A Data Driven Roadmap to Sub 25 nm Bonding Overlay in Wafer to Wafer Hybrid Bonding

Serena Iacovo, koen D'havé, Utkarsh Jain, Hung-Chieh Tsai et autres

us (code pays fourni par la source)

An 8-Lane 58 Gb/s/lane 0.66 pJ/bit Modulator Driver Electrical-IC for a 3-D Integrated Silicon Photonic Transmitter in 22 nm FD-SOI Process

László Szilágyi, Bartek J. Pawlak, Luc Pauwels, Pieter Bex et autres

A modulator driver circuit for electro-absorbtion modulators (EAMs) is designed in 22 nm FD-SOI technology as part of the electrical integrated circuit (EIC) of a 3D-integrated 8 -lane silicon photonic (SiPh) transmitter. The high driving voltage EAMs require, exceeding the breakdown voltage …

de, ca, be, gb, us (code pays fourni par la source)

2 μm Pitch Direct Die-to-Wafer Hybrid Bonding Using Surface Protection During Wafer Thinning and Die Singulation

Lin Ye, Pieter Bex, Samuel Suhard, Boyao Zhang et autres

To preserve the bonding surface quality, this paper proposes and demonstrates the feasibility of incorporating an inorganic protective layer in the direct die-to-wafer (D2W) hybrid bonding flow. The bonding surface is found well preserved even after wafer thinning and die singulation: Cu …

be (code pays fourni par la source)

Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift

Tiffany Y. Tang, Alice Guerrero, Dieter Cuypers, Maarten Macours et autres

This study aims to link several epoxy mold compound (EMC) material properties to warpage and die-shift that are typically present in a fanout wafer level packaging process flow with RDL last process conditions. Two EMC compounds with different CTE, Tg, and modulus …

be (code pays fourni par la source)

Impact of Temporary Substrates & Adhesives on Die-to-Wafer Overlay

Koen Kennes, Pieter Bex, Lin Ye, Samuel Suhard et autres

A critical review of the alignment factors contributing to the final die-to-target wafer overlay in a collective die to wafer bonding flow is presented and discussed in terms of minimal residual bonding errors. The impact of several substrates, such as glass vs …

be (code pays fourni par la source)

Overlay Analysis and Optimization for High-Accuracy Hybrid D2W Bonding

Pieter Bex

In this study we analyze the misalignment of dielectric bonded die-to-wafer (D2W) assemblies using a direct D2W bonding approach. Understanding the overlay error contributors is essential to enable high accuracy direct hybrid D2W bonding. Next to the translation and rotation placement error, …

Overlay Scaling Error Reduction for Hybrid Die-to-Wafer Bonding

Pieter Bex, Mario González, Steven Brems, Alain Phommahaxay et autres

Over the past decade, significant efforts have been made to understand and reduce overlay errors in Wafer-To-Wafer (W2W) hybrid bonding processes. More recently, Die-To-Wafer (D2W) hybrid bonding is gaining a lot of attention. New generations of high accuracy D2W bonders reduce the …

be, at (code pays fourni par la source)

Multi-tier die stacking through collective die-to-wafer hybrid bonding

Koen Kennes, Lin Ye, Samuel Suhard, Pieter Bex et autres

A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a target wafer. The N=2 die-level is shown to be consistently free of bonding voids …

be, us, de (code pays fourni par la source)

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm

Lin Ye, Pieter Bex, Koen Kennes, Jaber Derakhshandeh et autres

In this paper, direct die-to-wafer (D2W) hybrid bonding flow is explored using plasma diced dies with bond pad pitch scaling down to 2 μm. All the die preparation steps (including backside thinning, plasma dicing, surface activation, and pick-and-place) are proposed and demonstrated …

be (code pays fourni par la source)

Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding

Pieter Bex, Alain Phommahaxay, Koen Kennes, Samuel Suhard et autres

Hybrid Cu/dielectric bonding is a well-established technology for Wafer-To-Wafer (W2W) bonding, but it is challenging to apply this technology to Die-To-Wafer (D2W) bonding. Very small particles on the die or wafer can lead to voids/non-bonded regions. Processes to clean and activate wafers …

Integration of plasma dicing in the collective die to wafer hybrid bonding process

Samuel Suhard, Koen Kennes, Pieter Bex, Violeta Georgieva et autres

In this paper, the integration of plasma dicing within the collective die to wafer hybrid bonding process flow will be discussed. A layer to protect Cu pads on the die bonding interface has been explored. The resulting dies were bonded to the …

be (code pays fourni par la source)

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

Serena Iacovo, Koen D’havé, Oguzhan Orkut Okudur, Joeri De Vos et autres

Wafer to wafer bonding studies were carried out on blanket and patterned highly warped wafers using SiCN as bonding dielectric material to gain a deeper understanding of SiCN-to-SiCN direct bonding and to assess the impact of wafer shape on bonding overlay results. …

be, at (code pays fourni par la source)