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Yong Han, Boon Long Lau, Lai Yee Chia, Sharon Pei Siang Lim et autres
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Yong Han, Boon Long Lau, Lin Ji, Gongyue Tang
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Xiaowu Zhang, Boon Long Lau, Huicheng Feng, Gongyue Tang et autres
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Huicheng Feng, Bin He, Gongyue Tang, Xiaowu Zhang et autres
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Power electronics inverters are a cornerstone of modern electric vehicle systems, where thermal management has emerged as a key barrier to achieving ambitious power density targets. This study addresses the critical issue of thermal non-uniformity in liquid-cooled inverters containing multiple discrete chips …
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Umesh Chand, Yu‐Chieh Chien, Shiv Kumar, Xuân Sáng Nguyễn et autres
This invited paper addresses the key technical challenges in developing high-performance and reliable SiC power devices—from epitaxy to packaging and reliability. Key innovation opportunities in SiC power device platform technologies are highlighted. Critical unit process modules are discussed, including (1) a high-growth-rate …
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Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau et autres
Future miniaturization of high-power electronics requires effective cooling technologies. Thereby, this study experimentally investigates an embedded two-phase liquid cooling solution. A thermal test vehicle (TTV) is fabricated with micro-pin fins embedded on the chip backside. A thin-film metal heater and two resistance …
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Huicheng Feng, Gongyue Tang, Wei Kin Tan
Continuous scaling of high-power electronics requires efficient cooling solutions. We hereby present a compact and integrable magnetohydrodynamic (MHD)-driven liquid metal (GaInSn) cooling system fully embedded in printed circuit boards (PCBs). Theoretical models for pressure head and flowrate are derived, showing that the …
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Bin He, Yong Hui Han, Huicheng Feng, Gongyue Tang
As 3D heterogeneous chip integration advances beyond Moore's Law scaling limitations, thermal management becomes increasingly critical due to blocked heat dissipation pathways in stacked architectures. This paper presents a novel diamond-based lateral heat extraction approach utilizing diamond interlayers with extended edges to …
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Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau et autres
Three-dimensional integrated circuits (3D ICs) enable a higher level of device integration for high-performance computing but also introduce significant thermal challenges due to increased power density. This letter demonstrates a two-phase liquid cooling approach for stacked high-power chips featuring backside-embedded micro-pin fins. …
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Huicheng Feng, Gongyue Tang, Xiaowu Zhang
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Huicheng Feng, Yong Han, Gongyue Tang, Ling Xie et autres
HBM increases its bandwidth and capacity by two-to three-fold with each generation within a constrained footprint. Further development of HBM can be enabled by hybrid bonding (HB) technology, which connects and vertically stacks memory chips with high precision to optimize density, performance, …
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