Guanzhi Wu

Parallel gap resistance soldering based on epitaxial growth: A strategy for achieving intermetallic-free and damage-free micro-joining

Guanzhi Wu, Nannan Chen, Zhichao Wang, Jusha Ma et autres

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Reliability of micro-resistance welded dissimilar connection between Ag-plated Kovar foil and GaAs space solar cell: Processing, microstructure and bonding strength

Yuhan Ding, Zhichao Wang, Jusha Ma, Chen Shen et autres

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Influence of redesigned electrode system on interfacial microstructures and thermal behaviors in resistance micro-welding of stranded conductor to interconnector

Guanzhi Wu, Nannan Chen, Zhichao Wang, Wei Yi et autres

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Microstructure evolution and formation mechanism of interfaces in parallel gap resistance welding of stranded Ag-plated Cu conductor to Ag interconnector

Nannan Chen, Zhichao Wang, Guanzhi Wu, Xuebin Zhuo et autres

In space flexible solar arrays, stranded Ag-plated Cu conductors and Ag interconnectors are preferred materials for energy transmission. Parallel gap resistance welding is a solderless micro-joining process that favors the reliability of joints between stranded Ag-plated Cu conductors and Ag interconnectors. It …

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Comparative Study on Thermal Generation and Weld Performances of Two Types of Micro-Resistance Welding Between Thick Multi-Strand Cu Wire and Kovar Interconnector with Different Electrode Systems

Guanzhi Wu, Nannan Chen, Zhichao Wang, Wei Yi et autres

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Effect of Surface Stripes on Electrical-Thermal–Mechanical Behaviors and Interfacial Bonding Formation in Parallel Gap Resistance Welding of Ag Interconnectors

Nannan Chen, Zhichao Wang, Wei Yi, Jusha Ma et autres

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Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

Tianhan Hu, Shun Li, Zhen Li, Guanzhi Wu et autres

The microstructure and mechanical properties of Sn-Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with negligible loss of the plasticity. Especially, …

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Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate

Tianhan Hu, Zhen Li, Guanzhi Wu, Shun Li et autres

ABSTRACT In this study, tin-bismuth-silver-indium (Sn-Bi-Ag-In) lead-free solder powders are prepared by the consumable-electrode direct current arc (CDCA) method. Without agglomeration, the satellite-free solder powders show good sphericity. The effect of solder powder sizes on the wettability and microstructure of Sn-Bi-Ag-In solder …

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Exceptional Cross-Tension Property in Resistance Spot Welded 7Mn Steels by Combining Cyclic Heat Treatment and Intercritical Annealing

Bingge Zhao, Yuan-Fang Wang, Kai Ding, Guanzhi Wu et autres

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Microstructure evolution and its effect on the stress rupture behavior of 9%Cr-CrMoV dissimilar welded joint

Kai Ding, Manjie Fan, Yi He, Xin Huo et autres

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Microstructure Evolution and Formation Mechanism of Interfaces in Parallel Gap Resistance Welding of Stranded Ag-Plated Cu Conductor to Ag Interconnector

Nannan Chen, Zhichao Wang, Guanzhi Wu, Xuebin Zhuo et autres

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Effect of High-Temperature Annealing on the Cross-Tension Property of Resistance Spot Welded Medium-Mn Steel

Bingge Zhao, Yuanfang Wang, Chenyu Sun, Kai Ding et autres

As one of the most promising 3rd generation advanced high strength steels (AHSS), medium Mn steels attract much attention because of their exceptional mechanical property and reasonable cost. However, their application in the modern automotive industry is limited by poor weldability. In …

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