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Profil bibliographique

Michael Ira Current

Informations fournies par OpenAlex. Research Africa ne déduit ni nationalité, ni poste, ni coordonnées personnelles.

399Publications signalées
1800Citations signalées
0Affiliations récentes

Les domaines associés

Integrated Circuits and Semiconductor Failure AnalysisSemiconductor materials and devicesSilicon and Solar Cell TechnologiesLibrary Science and AdministrationIon-surface interactions and analysis

Les publications récentes

Accès ouvert 2024 article OpenAlex

Exploration of High‐Pressure Annealing and Microwave Annealing in Palladium Germano‐Silicide Formation for Si0.8Ge0.2‐Based Complementary Metal‐Oxide–Semiconductor Transistors

Tai‐Chen Kuo, Michael Ira Current

In this study, forming palladium germano‐silicide on Si0.8Ge0.2‐based complementary metal‐oxide semiconductor (CMOS) transistors by high‐pressure annealing compared to microwave annealing is investigated. Boron‐doped Si0.8Ge0.2 layers are epitaxially grown on n‐type Si wafers, achieving an initial boron concentration of 5 × 1015 cm−3, …

tw, us (code pays fourni par la source)

1 citation Advanced Engineering Materials
Accès ouvert 2024 article OpenAlex

Investigation of the activation and diffusion of ion-implanted p-type and n-type dopants in germanium using high-pressure annealing

Tai‐Chen Kuo, Wen-Hsi Lee, Michael Ira Current

Abstract In this study, we investigate the effectiveness of high-pressure annealing (HPA) compared to microwave annealing (MWA) in activating n-type and p-type dopants in germanium. For phosphorus dopants, HPA at 500 °C significantly enhances the activation level, resulting in a reduction of …

tw, us (code pays fourni par la source)

0 citations Japanese Journal of Applied Physics
Accès ouvert 2024 article OpenAlex

Effects of Ion Channeling and Co-Implants on Ion Ranges and Damage in Si: Studies With PL, SRP, SIMS and MC Models

Michael Ira Current, Takuya Sakaguchi, Yoji Kawasaki, Viktor Samu et autres

This study uses photoluminescence (PL) and other carrier-recombination sensitive probes in combination with spreading resistance profiling (SRP), SIMS and IMSIL MC-calculations to monitor the ion range and damage levels in highly-channeled and random beam orientation 7.5 MeV B and 10 MeV P …

hu (code pays fourni par la source)

0 citations IEEE Journal of the Electron Devices Society
Accès ouvert 2023 erratum OpenAlex

Corrections to “Low-Temperature Microwave Annealing Processes for Future IC Fabrication—A Review” [Mar 14 651-665]

Yao‐Jen Lee, Ta-Chun Cho, Shang-Shiun Chuang, Fu-Kuo Hsueh et autres

The above article[1]presented data on microwave annealing of implanted ions in silicon. There are several typos in the figure captions and labels, and the authors would like to correct them. The text is correct, and the conclusion of[1]is not impacted by these …

tw (code pays fourni par la source)

0 citations IEEE Transactions on Electron Devices
2023 conference-paper OpenAlex

Effects of Ion Channeling and Co-implants on Ion Ranges and Damage in Si: Studies with PL, SRP, SIMS and MC models

Michael Ira Current, Takuya Sakaguchi, Yoji Kawasaki, Viktor Samu et autres

This study uses photoluminescence (PL) and other carrier-recombination sensitive probes in combination with spreading resistance profiling (SRP), SIMS and IMSIL MC-calculations to monitor the ion range and damage levels in highly-channeled and random beam orientation 7.5 MeV B and 10 MeV P …

jp, hu (code pays fourni par la source)

0 citations
Accès ouvert 2023 erratum OpenAlex

Corrections to “Susceptor Coupling for the Uniformity and Dopant Activation Efficiency in Implanted Si Under Fixed-Frequency Microwave Anneal” [Feb 12 248-250]

Yao‐Jen Lee, Fu-Kuo Hsueh, Michael Ira Current, Ching‐Yi Wu et autres

In The above letter[1], the SIMS profiles in Fig. 1 are for diffusion characteristics of ion-implanted phosphorus before/after MWA. We did not mention the concentration in the text of the letter. However, the dose listed in the figure caption is incorrect. The …

tw (code pays fourni par la source)

0 citations IEEE Electron Device Letters

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