2026
conference-paper
OpenAlex
Yusaku Imasaku, Atushi Sanagawa, Isao Masada, Go Hamasaka et autres
Heat generation from electronic devices has become a significant issue due to increasing density of semiconductor devices. Thermal interface materials (TIM) are used as heat conductors between heat sources and heat sinks in electronic devices. As a filler for TIM, aluminum nitride …
jp
(code pays fourni par la source)
2025
conference-paper
OpenAlex
M. Takakusaki, Isao Masada, Yoshiyuki Iizuka, T. Hamasaka et autres
To release heat of integrated circuits and power devices, thermal interface material (TIM) is used as a heat conductor between a heat source and a heat sink. The increasing of the thermal conductivity of the fillers is necessary to increase the thermal …
jp
(code pays fourni par la source)
2023
conference-paper
OpenAlex
Takefumi Iida, Atsushi Sakamoto, Isao Masada, Saiko Fujii et autres
To release heat of integrated circuits and power devices, thermal interface material (TIM) is used as a heat conductor between a heat source and a heat sink. High thermal conductivity and electrical insulation property are required in TIM, according to the high …
jp
(code pays fourni par la source)
2021
conference-paper
OpenAlex
Kyoichi Fujinami, S. Imazumi, Saiko Fujii, Isao Masada et autres
Novel low aspect ratio primary hexagonal Boron Nitride (BN) particles and agglomerated BN filler were developed by carbo-thermal-reduction and nitridation (CRN) method in this study. They were used as high thermal conductivity filler for resin composite. Especially, viscosity of epoxy resin filled …
jp
(code pays fourni par la source)
2020
conference-paper
OpenAlex
Yoshitaka Inaki, Hisamori Inagawa, Saiko Fujii, Isao Masada et autres
Aluminum nitride (AlN) powder has has high thermal conductivity and is expected as filler for heat dissipation materials. Fine AlN powder after removing coarse particles by classification is well dispersed into resin, and it is possible to achieve high filling rate and …
jp
(code pays fourni par la source)
2019
conference-paper
OpenAlex
Isao Masada, Saiko Fujii, S. Imazumi, Kyoichi Fujinami et autres
In order to investigate the possibility of high thermal conductivity material, composite resin sheets combining large grain size AlN filler and agglomerated BN filler were prepared and heat conductivity characteristics were evaluated. In combination with BN filler, the superiority of AlN filler …
jp
(code pays fourni par la source)
Accès ouvert
2017
article
OpenAlex
Hirotatsu Kiuchi, Michio Tajima, Fumito Higuchi, Atsushi Ogura et autres
Abstract We attempted the quantification of carbon concentration in Czochralski-grown Si crystals for solar cells by luminescence activation in the concentration range lower than the detection limit of IR absorption spectroscopy. A positive correlation was found between the relative intensity of the …
jp
(code pays fourni par la source)
2017
conference-paper
OpenAlex
Takuto Kojima, Ryota Suzuki, Kosuke Kinoshita, Kyotaro Nakamura et autres
The behavior of oxygen precipitates under solar cell fabrication processes and the effect on device performance were investigated using TEM observation. Samples were prepared with different carbon concentration and with two sets of growth conditions. The number of precipitates correlates monotonically with …
jp
(code pays fourni par la source)
Accès ouvert
2017
article
OpenAlex
Tomihisa Tachibana, Kyotaro Nakamura, Atsushi Ogura, Yoshio Ohshita et autres
The effects of residual C on cell properties are investigated from the view point of thermal budget in the n-type bifacial cell processes. Implied Voc obtained from wafers with same Oi concentration depend on the thermal budgets decreases as the Cs concentration …
jp
(code pays fourni par la source)
2017
article
OpenAlex
Takuto Kojima, Kosuke Kinoshita, Ryota Suzuki, Kyotaro Nakamura et autres
2017
article
OpenAlex
Kousuke Kinoshita, Takuto Kojima, Ryota Suzuki, Hiroto Kobayashi et autres
2016
article
OpenAlex
Takuto Kojima, Kosuke Kinoshita, Ryota Suzuki, Kyotaro Nakamura et autres