2015
article
OpenAlex
Pradeep Lall, Kewal Patel, Vikalp Narayan
Package-on-package (PoP) assemblies may experience warpage during package fabrication and later during surface mount assembly. Excessive warpage may result in loss of coplanarity, open connections, misshaped joints, and reduction in package board-level reliability under environmental stresses of thermal cycling, shock, and vibration. …
us
(code pays fourni par la source)
2013
conference-paper
OpenAlex
Pradeep Lall, Kewal Patel, Vikalp Narayan
Package-on-Package (PoP) assemblies may experience warpage during package fabrication and later during surface mount assembly. Excessive warpage may result in loss-of-coplanarity, open connections, mis-shaped joints, and reduction in package board-level reliability (BLR) under environmental stresses of thermal cycling, shock and vibration. Previous …
us
(code pays fourni par la source)
2013
dissertation
OpenAlex
Kewal Patel
2012
article
OpenAlex
Pradeep Lall, Kewal Patel, Ryan D. Lowe, Mark Strickland et autres
ABSTRACT Electronics in aerospace applications may be subjected to very high g-loads during normal operation. A novel micro-coil array interconnect has been studied for increased reliability during extended duration aerospace missions in presence of high-g loads. Ceramic area-array components have been populated …
us
(code pays fourni par la source)
2012
conference-paper
OpenAlex
Pradeep Lall, Kewal Patel, Ryan D. Lowe, Mark Strickland et autres
Electronics in aerospace applications may be subjected to very high g-loads during normal operation. A novel micro-coil array interconnect has been studied for increased reliability during extended duration aerospace missions in presence of high-g loads. Ceramic area-array components have been populated with …
us
(code pays fourni par la source)
2012
conference-paper
OpenAlex
Pradeep Lall, Kewal Patel, Ryan D. Lowe, Mark Strickland et autres
Electronics in aerospace applications may be subjected to very high g-levels during normal operation. A column array interconnect has been studied for reliability during extended duration aerospace missions in presence of high-g levels. Ceramic area-array components have been populated with column interconnects. …
us
(code pays fourni par la source)
2006
conference-paper
OpenAlex
S. Sankaran, S. Arai, R. A. Augur, Mattias Beck et autres
A high performance 45nm BEOL technology with proven reliability is presented. This BEOL has a hierarchical architecture with up to 10 wiring levels with 5 in PECVD SiCOH (k=3.0), and 3 in a newly-developed advanced PECVD ultralow-k (ULK) porous SiCOH (k=2.4). Led …
us, ca, gb, kr
(code pays fourni par la source)
2002
conference-paper
OpenAlex
P.M. Phillips, Kewal Patel, J.A. Monzel, William R. Reohr et autres
It is noted that differential circuits are prone to a class of faults that reduce the signal between the two outputs without causing a stuck fault or delay. The authors examine the addition of test bias circuits to aid testing of these …
us
(code pays fourni par la source)
2002
conference-paper
OpenAlex
V. Atluri, L.M. Dass, Krishna Seshan, Kewal Patel et autres
In this paper we present the results related to thermomechanical failures (TMF) in silicon integrated circuits assembled in plastic packages. Damage to silicon was believed to be caused by the thermal mismatch stress due to large difference in coefficients of thermal expansion …
us
(code pays fourni par la source)