Sang‐Hoon Bae

Heterogeneous photonic integration of single-crystalline nanomembranes

Yuan Meng, Wenbo Mao, Zhihao Xu, Di Jia et autres

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Deposition-Free Anti-Reflective Nanomembrane Lamination for Ultrathin Photodetectors

Hyung Jun Kwun, Soheil Ghods, Hochan Jang, Jungwoo Bong et autres

The transition toward function-centric three-dimensional heterogeneous integration (3DHI) requires ultrathin photodetectors with strong photoresponse and compatibility with vertical stacking. Monolayer transition metal dichalcogenides (TMDCs) are promising active layers for such systems but suffer from intrinsically limited light absorption. Moreover, strategies for enhancing …

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Governing Thermal Transport in Three-Dimensional Electronics

Kyubeen Kim, Minho Jin, Sanggeun Bae, Sejin Lee et autres

Thermal management has emerged as a materials bottleneck for three-dimensional integrated circuits, which are being actively explored to enable dense vertical connectivity and mitigate interconnect delay and energy consumption. Unlike 2D-structure chips, stacked tiers confine dissipation within a boundary-rich back-end-of-line (BEOL) heterostructure. …

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Statistically Resolving Thickness‐Dependent Electrical Characteristics in Multilayer‐MoS 2 Transistors (Adv. Funct. Mater. 45/2026)

Sanghyun Lee, Sumin Hong, Minho Park, Seongju Kim et autres

Single-Flake Transistor In the Research Article (DOI: 10.1002/adfm.202532204), Yongwoo Lee, Haksoon Jung, Jimin Kwon, and co-workers demonstrate that 3-8 layer MoS2 flakes can be reliably classified using pixel intensity contrast in the red, green, and blue optical channels. This approach enables large-scale …

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Laser mode braiding on a chip

Wenbo Mao, Bofeng Zhu, Qian Zhang, Weijie Xu et autres

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Gate dielectric stack design for 2D materials-based electronics

Minho Jin, Hojun Kim, Sejin Lee, Sangmoon Han et autres

Two-dimensional (2D) semiconductors enable atomically thin channels and attractive electrostatics, but practical scaling increasingly hinges on gate-dielectric integration rather than channel performance. A key challenge is forming high-quality dielectrics on chemically inert, dangling-bond-free 2D surfaces while pushing equivalent oxide thickness to the …

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Material Innovation for 3D AI hardware

Sang‐Hoon Bae

Freestanding nanomembranes, ranging from 2D materials to ultrathin single-crystalline 3D membranes, have emerged as their exceptionally low stiffness ensures intimate skin or tissue conformality, minimizing mechanical mismatch and maximizing signal fidelity. Their single crystallinity offers high electronic performance, while their stackable form …

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Event-Driven Neuromorphic Gaze Decoding via e-Skin Electrooculography

Siwoo Jeong, Hyun Woo Ko, Ji‐Hoon Kang, Jonghyeon Ko et autres

Wearable eye-tracking technologies remain constrained by bulky optics, high power consumption, and reliance on external computation. We present a hardware-software codesigned electrooculography (EOG) interface that integrates ultrathin conformal e-skin sensors with resistive random-access memory (RRAM) crossbar, used to implement synaptic vector-matrix multiplication …

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Two-dimensional materials for integrated sensing

Hangyu Xu, Zhihao Xu, Qinqi Ren, Yuan Meng et autres

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Statistically Resolving Thickness‐Dependent Electrical Characteristics in Multilayer‐MoS 2 Transistors

S. W. Ricky Lee, Sumin Hong, Minho Park, Seongju Kim et autres

ABSTRACT Atomically thin 2D semiconductors enable excellent electrostatic control even in highly scaled transistors with few‐nanometer gate lengths. The electrical characteristics of 2D transistors can vary significantly with the number of layers, yet how device behavior evolves with channel thickness remains statistically …

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Twelve-inch electrically anisotropic boridene for optoelectronic computing

Yiqiang Zheng, Hangyu Xu, Yong Xu, Z. Y. Li et autres

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Heterogeneous van der Waals integration of single-crystalline photonic nanomembranes

Sang‐Hoon Bae, Yuan Meng, Wenbo Mao, Zhihao Xu et autres

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