Testing of Chiplet-Based Packages Based on Advanced Heterogeneous Integration
Partho Bhoumik, Dhruv Thapar, C. Bailey, Krishnendu Chakrabarty
0 citationsIEEE Design and Test
C. Bailey
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684Publications signalées
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Electronic Packaging and Soldering Technologies3D IC and TSV technologiesSilicon Carbide Semiconductor TechnologiesElectromagnetic Compatibility and Noise SuppressionManufacturing Process and Optimization
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