Accès ouvert
2026
article
OpenAlex
Kunlun Li, Minjia Xu, Lu Jia, Yuan Gao et autres
Releasing a thin film adhered to a rigid substrate by peeling is a fundamental issue in interfacial mechanics and is of practical significance in many fields including flexible electronics, heterogeneous integration, and advanced packaging. While classical peeling theories have established the relationship …
cn
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Accès ouvert
2025
article
OpenAlex
Minjia Xu, Zhixin Li, Shufeng Lu, Guangchen Ma et autres
In low-frequency transmission, traditional current transformers face the problem of saturation distortion issues, while utilizing materials with high magnetic saturation intensity could add measurement errors. In order to solve this problem, the mixed materials current transformer (MMCT) is proposed, which uses two …
cn, hk
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2016
article
OpenAlex
P Zhang, Huibin Jia, J Li, A B Wu et autres
2014
conference-paper
OpenAlex
Hailong Zhao, Minjia Xu, Limei Yan, Fuzhi Lv
Welcome to the WIT Press eLibrary - the home of the Transactions of the Wessex Institute collection, providing on-line access to papers presented at the Institute's prestigious international conferences and from its State-of-the-Art in Science & Engineering publications.
cn
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2003
article
OpenAlex
Minjia Xu, T.H. Hubing
In multilayer printed circuit boards, the noise on the power bus is influenced by the impedance between the power and ground planes. Power-bus noise estimates require an accurate estimate of the power-bus input impedance. This paper develops a closed-form estimate of the …
us
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2003
article
OpenAlex
Hao Wang, Minjia Xu, Chen Wang, T.H. Hubing
When numerically modeling structures with imperfect conductors or conductors coated with a dielectric material, impedance boundary conditions (IBCs) can substantially reduce the amount of computation required. This paper incorporates the IBC in the finite-element method (FEM) part of a FEM/method of moments …
us
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2003
article
OpenAlex
Minjia Xu, Hao Wang, T.H. Hubing
Power-return plane pairs in printed circuit boards are often modeled as resonant cavities. Cavity models can be used to calculate transfer impedance parameters used to predict levels of power bus noise. Techniques for applying the cavity model to lossy printed circuit board …
us
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2003
article
OpenAlex
Minjia Xu, T.H. Hubing, T.P. Van Doren, James L. Drewniak et autres
This paper experimentally investigates the effectiveness of embedded capacitance for reducing power-bus noise in high-speed printed circuit board designs. Boards with embedded capacitance employ closely spaced power-return plane pairs separated by a thin layer of dielectric material. In this paper, test boards …
us
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2002
conference-paper
OpenAlex
Minjia Xu, T.H. Hubing, Juan Chen, James L. Drewniak et autres
This paper investigates the power bus noise and power bus impedance of printed circuit boards with four different kinds of embedded capacitance. These boards have power-ground plane pairs separated by a very thin layer of material with high dielectric permittivity. It is …
us
(code pays fourni par la source)
2002
conference-paper
OpenAlex
Minjia Xu, Yun Ji, T.H. Hubing, T.P. Van Doren et autres
This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion method. The results are validated by experiments and full-wave numerical modeling. It is shown that the power bus can be modeled as a series L/sub e/C circuit …
us
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2002
conference-paper
OpenAlex
Juan Chen, Minjia Xu, T.H. Hubing, James L. Drewniak et autres
The switching of active devices on printed circuit boards (PCBs) can cause a momentary surge or drop in the power bus voltage. Decoupling capacitors are often utilized to alleviate this problem. They help to stabilize the power bus voltage by supplying transient …
us
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2002
article
OpenAlex
Minjia Xu, T.H. Hubing
Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved by enhancing the natural capacitance between closely spaced power and return planes. This paper employs a simple cavity model to investigate the features affecting the power bus impedance of printed …
us
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