Yuyu Peng

Ag@Au@4-NPH@ZIF-8 based nucleophilic addition strategy for SERS detection of gaseous acetone

Yuyu Peng, Chunyan Wang, Xiwang Li, Xiaofeng Zhou et autres

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The Efficient and Sensitive Detection of Serum Dopamine Based on a MOF-199/Ag@Au Composite SERS Sensing Structure

Yuyu Peng, Chunyan Wang, Gen Li, Jianguo Cui et autres

In this study, a MOF-199/Ag@Au SERS sensing structure was successfully synthesized by combining metal–organic frameworks (MOFs) with surface-enhanced Raman scattering (SERS) technology for the efficient detection of dopamine (DA), a biomarker for neurological diseases, in serum. Using electrochemical methods, a copper-based MOF …

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Facile Preparation of TiO2NTs/Au@MOF Nanocomposites for High-Sensitivity SERS Sensing of Gaseous VOC

Chunyan Wang, Yuyu Peng, Jia Huo

Surface-enhanced Raman spectroscopy (SERS) is a promising and highly sensitive molecular fingerprint detection technology. However, the development of SERS nanocomposites that are label-free, highly sensitive, selective, stable, and reusable for gaseous volatile organic compounds (VOCs) detection remains a challenge. Here, we report …

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An Improved Darveaux Model to Predict Thermal Cycling Life of the Panel Level Package

Shiqi Liang, Min Ren, Yuyu Peng, Chun-Ying Zhou et autres

The Panel level package (PLP) is gradually applied to some power devices due to its lower parasitic parameters, lower material cost, and higher packaging efficiency. In most application scenarios, the solder layer fatigues with temperature fluctuations. Thermal cycling life prediction is an …

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Temperature Cycling Failure Analysis and Improvement of A Panel Level Fan-out QFN Package

Li Chen, Wei Gao, Yan Huo, Lei Xie et autres

This article analyzed the temperature cycling test failure root cause and molding film crack mechanism of a panel level fan-out QFN package. Improvement actions are proposed according to Kitagawa-Takahashi diagram. In the micro crack stage, reducing the thermal stress is the key …

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Thermal stress failure analysis of power diode SMBF package

Yuyu Peng, Wei Gao, Qiao Guo, Bo Zhang

With the development of power devices, the thermal reliability of power devices has become a research hot spot. The research object of this paper is the power diode of SMBF package. Through X-ray scanning and resin removal observation, it can be concluded …

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Influence of Solder Layer Void on Thermal Stability for Power Semiconductor Device

Wei Gao, Qiao Guo, Yuyu Peng, Min Ren et autres

Solder layer void is one of the causes of thermal failure for power semiconductor device. In this study, influence of solder layer void with different diameter and position on the thermal stability for power device in different package form is observed and …

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