2023
conference-paper
OpenAlex
Sreedhar Reddy Pacharla, Pavan Kumar Prasad, Suryansh Vimlendra, Saurav Varshney et autres
A modern car is enhancing the driver’s in-vehicle experience through the infotainment system which is a combination of both information and entertainment. The Original Equipment Manufacturers (OEM) are being driven to provide this luxurious experience through the development and adaptation of new …
gb
(code pays fourni par la source)
2021
conference-paper
OpenAlex
S. Cea, S. Berrada, Kasturi Ghosh, Sayed Hasan et autres
Process and device simulation has been invaluable for logic technology development for many technology nodes. The main goal of this work will be to review the broad and diverse simulation hierarchy that is used in industry to understand and optimize both current …
us
(code pays fourni par la source)
2021
article
OpenAlex
Vivek Agrawal, Balasubramanian Achuthan, Asadullah Ansari, Vishal A. Tiwari et autres
The modern automobile consists of several Electronic Control Units (ECUs) to support various safety-critical functionalities. The underlying systems are susceptible to safety and cybersecurity attacks as the involved ECUs are interconnected. The security attacks can lead to disrupting the safe operation of …
gb
(code pays fourni par la source)
2019
conference-paper
OpenAlex
M. Stettler, S. Cea, Sayed Hasan, Lei Jiang et autres
In the past 25 years, process and device TCAD used in direct support of industrial process development has undergone radical change. In the era of Dennard scaling [1], TCAD efforts in manufacturers such as Intel could arguably be described as advanced applications …
us
(code pays fourni par la source)
2018
book-chapter
OpenAlex
Mourina Ghosh, Bal Chand Nagar, Vishal A. Tiwari
in
(code pays fourni par la source)
2018
article
OpenAlex
Vishal A. Tiwari, R. Divakaruni, Terence B. Hook, Deleep R. Nair
Parameter variations in the transistor characteristics with new materials and process steps pose an increasing challenge for CMOS scaling to nanometer feature size. Alternate channel materials such as silicon- germanium (SiGe) for p-type field effect transistor (pFET) at 32 nm and beyond …
us, in
(code pays fourni par la source)
2016
conference-paper
OpenAlex
Vishal A. Tiwari, Ch. L. N. Pavan, Deleep R. Nair, R. Divakaruni et autres
Variability in the transistor parameters play a significant role in CMOS scaling to nanometer feature sizes. New channel materials such as silicon-germanium for pFET at 32nm and beyond are useful because of higher mobility and lower threshold voltage. However, gate-induced drain leakage …
in, us
(code pays fourni par la source)
2016
article
OpenAlex
Vishal A. Tiwari, R. Divakaruni, Terence B. Hook, Deleep R. Nair
Abstract Silicon–germanium is considered as an alternative channel material to silicon p-type FET (pFET) for the development of energy efficient high performance transistors for 28 nm and beyond in a high- k metal gate technology because of its lower threshold voltage and …
in, us
(code pays fourni par la source)
2015
conference-paper
OpenAlex
Vishal A. Tiwari, A. Scholze, R. Divakaruni, Deleep R. Nair
2015
article
OpenAlex
Vishal A. Tiwari, Young Way Teh, D. Jaeger, R. Divakaruni et autres
Silicon-germanium (SiGe) channel pMOSFET is considered as a replacement for silicon channel device for 32-nm node and beyond, because of its lower threshold voltage and higher channel mobility. Lower SiGe bandgap makes gate-induced drain leakage (GIDL) important for low leakage, high threshold …
in, sg, us
(code pays fourni par la source)
2014
conference-paper
OpenAlex
Vishal A. Tiwari, A. Scholze, R. Divakaruni, Deleep R. Nair
Silicon-Germanium is used as an alternative channel material for pFET in high-k metal gate-first technologies for 32 nm and beyond. However, gate-induced drain leakage (GIDL) is significant at nominal bias due to band-to-band tunneling (BTBT) at the gate-to-drain overlap surface and gate …
in, us
(code pays fourni par la source)
2014
article
OpenAlex
Vishal A. Tiwari, D. Jaeger, A. Scholze, Deleep R. Nair
Silicon-germanium is an alternative channel material for pMOS FETs at 32-nm node and beyond because of lower threshold voltage and higher channel mobility in high-k metal gate technology. However, gate-induced drain leakage (GIDL) is a major concern at low power technology nodes …
in, us
(code pays fourni par la source)