Taoying Rao

Design of Poly(ionic liquid)/Silver–Liquid Metal Composites for High-Performance Thermal Interface Materials

Yilan Guo, Zhaoyu Lin, Longfeng Zou, Yucheng Jiang et autres

cn (code pays fourni par la source)

Supratopological Ion‐Coordinated Binder Networks for Durable and Kinetically Efficient Silicon Anodes

Dejian Cheng, Bin Tan, Yong Zeng, Taoying Rao et autres

ABSTRACT The practical deployment of silicon (Si) anodes is limited by coupled mechanical failure and sluggish electrochemical kinetics arising from repeated volume expansion. While polymer binders are critical to electrode integrity, conventional designs often prioritize mechanical strength over ion transport. Here, a …

cn (code pays fourni par la source)

Poly(ionic liquid) Composites with Liquid Metal-Copper Hybrid Networks for High-Performance Thermal Interface Materials

Yucheng Jiang, Jianhui Zeng, Longfeng Zou, Taoying Rao et autres

Poly(ionic liquid)‐Based Thermal Interface Materials with Enhanced Interfacial Adhesion and Thermal Stability for Advanced Electronic Cooling

Xin Luo, Baohao Yang, Taoying Rao, Jianhui Zeng et autres

Abstract The surge in AI technologies and the new energy sector has intensified the demand for efficient thermal management, now a key technological bottleneck. Silicone‐based thermal interface materials (TIMs) dominate but suffer from oil bleeding, weak interfacial adhesion, and thermal aging. Alternative …

cn (code pays fourni par la source)

Poly(Ionic Liquid) matrices embedded with liquid metal particles: A versatile solution for high-power density thermal management

Jianhui Zeng, Taoying Rao, Ting Liang, Yimin Yao et autres

Amid the global surge in generative AI and the resulting compute revolution, thermal management has emerged to be a pivotal determinant of its success. Innovation in thermal interface materials (TIMs) now represents a strategic frontier in shaping the trajectory of the Fourth …

cn, hk (code pays fourni par la source)

Engineering Poly(ionic liquid) Composites for Silicone-Free Thermal Interface Materials: Enhanced Thermal Conductivity and Interfacial Adhesion

Xin Luo, Jianhui Zeng, Taoying Rao, Yucheng Jiang et autres

The rapid advancement of artificial intelligence, coupled with increasing device miniaturization and power density, has made thermal management a critical bottleneck limiting reliability and performance. Thermal interface materials (TIMs), which bridge chips and heat sinks, are essential in reducing thermal resistance. Silicone-based …

cn (code pays fourni par la source)

Thermally conductive and self-healable liquid metal elastomer composites based on poly(ionic liquid)s

Jianhui Zeng, Xuancheng Li, Ting Liang, Taoying Rao et autres

The rapid advancement of high-density chip packaging, driven by the AI revolution, demands high-performance thermal interface materials (TIMs). Nvidia’s GPU Blackwell B200 exceeds 800 W/cm 2 in heat flux, underscoring the challenge of efficient heat management as chips shrink and power density …

cn, hk (code pays fourni par la source)

Poly(ionic liquid) thermal gels enabling compliant and adhesive interfaces for chip-scale thermal management

Jianhui Zeng, Taoying Rao, Hang Shi, Yilan Guo et autres

The increasing die size, package dimensions and operating heat flux of AI chips impose stringent requirements on the mechanical compliance and reliability of chip-level thermal interface materials (TIMs). Polymer-based TIMs, particularly silicone gels, offer advantages such as mechanical flexibility, automated dispensability, and …

Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials

Jianhui Zeng, Ting Liang, Baohao Yang, Taoying Rao et autres

The swift progression of high-density chiplet packaging, propelled by the artificial intelligence revolution, has precipitated a critical need for high-performance chip-scale thermal interface materials (TIMs). The elevated thermal resistance, limited interfacial adhesion, and mechanical flexibility intrinsic to silicone systems present a substantial …

cn, hk (code pays fourni par la source)

Exploring the Aging Characteristics of Poly(Ionic Liquid)S-Based Thermal Interface Materials

Jianhui Zeng, Baohao Yang, Zeyu Zheng, Taoying Rao et autres

Thermal interface materials (TIMs) are essential for managing heat in electronics. Silicone systems face challenges such as leakage of silane molecules, limited mechanical flexibility, poor filler compatibility and weak interfacial adhesion. In contrast, poly(ionic liquid)s (PILs) have emerged as promising alternatives due …

cn (code pays fourni par la source)

An easy-to-prepare flexible 3D network aqueous binder with gradient hydrogen bonding for high-performance silicon anodes

Dejian Cheng, Yuqi Liu, Zenan Li, Taoying Rao et autres

cn, ca (code pays fourni par la source)

A water-based binder with 3D network enabling long-cycle-life silicon/graphite composite anode materials for lithium ion batteries

Dejian Cheng, Peilong Ni, Denglin Qin, Yuanfa Guo et autres

cn (code pays fourni par la source)