Fan-out RDL process and shuttle service

Le résumé fourni par la source

With the rapid advancement of artificial intelligence (AI) technologies, AI chips have emerged as a cornerstone in enabling high-performance and data-intensive applications. A wide spectrum of related products is actively exploring approaches to integrate AI functionality. A defining characteristic of such innovative products and startups is the demand for diverse, small-volume, and rapid prototyping capabilities. To support the semiconductor industry in addressing this highly dynamic and innovation-driven market, novel production paradigms tailored for small-volume manufacturing are essential. To this end, we propose a shuttle service platform that significantly reduces both the cost and time associated with new product development through mask-sharing strategies. This approach facilitates experimental iteration and product realization at reduced cost and accelerated pace, thereby enhancing the competitiveness of startups and emerging technologies in the market.

Ce résumé expose les affirmations des auteurs. BNTIC ne l’interprète pas comme une validation indépendante des résultats.