Micromachined Force Sensors for Characterization of Chemical Mechanical Polishing

Le résumé fourni par la source

Micromachined structures with diameters ranging from 50 - 100 µm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 µm high poly-dimethyl-siloxane posts with bending stinesses ranging from 1.6 to 14 µN/µm. The structures were polished using a sti, ungrooved pad and 3 wt% fumed silica slurry at relative velocities of approximately 0.5 m/s and downforces of approximately 1 psi. Observed lateral forces on the structures were on the order of 5-500 µN in magnitude, and highly variable in time.

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