Heterodimensional Interface Engineering in Phase Change Regulator for Thermal Buffering and Microwave Dissipation
Yang Li, Mulin Qin, K Jia, Haiwei Han et autres
ABSTRACT High‐power density electronic devices face intertwined challenges of localized thermal shock and electromagnetic interference, constraining their performance, reliability, and lifespan. Herein, this study proposes a heterodimensional interface engineering strategy to fabricate dual‐functional phase change regulator capable of synergistically achieving efficient thermal …
cn (code pays fourni par la source)
2 citations
Advanced Functional Materials