Applicability of Both-Sided Flash Lamp Annealing (FLA) Method on Heat Treatment Cu Plating Thin Film and Low Dielectric Resin Films
Joo-Hyong Noh, D. O. Yi, Yui Shishido, J. B. Park et autres
Annealing is an important post-treatment for improving adhesion strength and metal crystallinity after plating to form electronic wiring with copper thin films. However, resin films often have low heat resistance, and annealing using conventional electric furnace can damage the film. Therefore, annealing …
jp, kr (code pays fourni par la source)
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