3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS
John Safran, G. Rangan, Venkata Nr Vanukuru, Sandeep Torgal et autres
High performance processors and ASICs typically require multiple voltages and multi-domain voltage controls across the die. Conventional approaches distribute the voltage regulation elements between the processor, the package laminate, and the printed circuit board. We propose an alternative approach where the voltage …
us, in, nl (code pays fourni par la source)
2 citations