Christopher Timmons

Evaluation of Cylindrical Asymmetric Surface Dielectric Barrier Discharge Actuators for Surface Decontamination and Mixing

Alvin Ngo, Kedar Pai, Christopher Timmons, Li Ma et autres

Surface dielectric barrier discharge (SDBD) was used to evaluate cylindrical plasma actuators for inactivation of Salmonella enterica. A cylindrical SDBD configuration was evaluated to determine if the inherent induced body force could be leveraged to impel plasma species, such as reactive oxygen …

us (code pays fourni par la source)

Process Development For An Undergraduate Microchip Fabrication Facility

David Gray, Christopher Timmons, R. W. Hendricks

We have built a microchip fabrication facility for teaching the elements of semiconductor processing to a multidisciplinary group of approximately 500 students per year from all areas of engineering, science, and even the humanities.In order to meet our pedagogical objectives of introducing …

us (code pays fourni par la source)

Points to Consider: Best Practices to Identify Particle Entry Routes along the Manufacturing Process for Parenteral Formulations

Sylvia Anger, Cecile Begat, Vincent Crnko, Gianmaurizio Fantozzi et autres

During the processes involved in pharmaceutical manufacturing, particulate matter may be introduced into a product from a variety of sources and at different points in the manufacturing process. Companies design quality at the beginning of the process to ensure against defects and …

de, ch, fr, us, gb (code pays fourni par la source)

Evaluation of Cylindrical Asymmetric Surface Dielectric Barrier Discharge Actuators for Surface Decontamination and Mixing

Kedar Pai, Christopher Timmons, Alvin Ngo, Jamey Jacob

In recent years, dielectric barrier discharge (DBD) has been used as an effective means of microbial inactivation. Surface DBDs in particular have exhibited promising results for surface decontamination.1By utilizing this method in different configurations utilizing its inherent induced body force, plasma species …

us (code pays fourni par la source)

Particulate Generation Mechanisms during Bulk Filling and Mitigation via New Glass Vial

Christopher Timmons, Chi Yuen Liu, Stefan Merkle

Contamination with foreign particulate matter continues to be a leading cause of parenteral drug recalls, despite extensive control and inspection during manufacturing. Glass is a significant source of particulate matter contamination; however, the mechanism, source, and quantification have not been extensively analyzed. …

us, ch (code pays fourni par la source)

Elucidation of the molecular mechanisms of foodborne human pathogen inactivation by cold atmospheric plasma through RNA-Seq analysis

Christopher Timmons

Foodborne human illness caused by pathogenic bacteria is a significant health and economic burden worldwide. Efficient food decontamination methods that do not alter food quality can greatly alleviate this burden. Cold atmospheric plasma, which is ionized gas generated at room temperature and …

Photoresist Removal Using Alternative Chemistries and Pressures

In Gu Song, Christopher Timmons, Galit Levitin, Dennis W. Hess

Approximately 20% of the processing steps in integrated circuit (IC) fabrication involve surface cleaning and removal of photoresist and plasma etch residues. Continuous device minimization requires the use of thin films (<20 nm), closely spaced features, and ultra shallow junctions (<50nm); as …

us (code pays fourni par la source)

Photoresist and Fluorocarbon Postplasma Etch Residue Removal Using Electrochemically Generated Radical Anions

Christopher Timmons, Dennis W. Hess

Integration of new materials into semiconductor manufacturing sequences demands cleaning processes that are compatible with copper and low dielectric constant (low- k ) materials. Conventional oxidative cleaning processes are currently used to remove fluorocarbon-based postplasma etch residues; however, these processes are generally …

us (code pays fourni par la source)

Photoresist and Etch Residue Removal

Galit Levitin, Christopher Timmons, Dennis W. Hess

In the fabrication of microelectronic devices and integrated circuits, fluorocarbon post-plasma etch residue removal is an important cleaning process. The low-surface energy and cross-linked nature of residues, combined with compatibility concerns between cleaning solutions and device film materials and structures, make such …

us (code pays fourni par la source)

Fluorocarbon Post-Etch Residue Removal Using Radical Anion Chemistry

Christopher Timmons

During fabrication of integrated circuits, fluorocarbon plasma etching is used to pattern dielectric layers. As a byproduct of the process, a fluorocarbon residue is deposited on exposed surfaces and must be removed for subsequent processing. Conventional fluorocarbon cleaning processes typically include at …

Electrochemical Cleaning of Post-Plasma Etch Fluorocarbon Residues Using Reductive Radical Anion Chemistry

Christopher Timmons, Dennis W. Hess

A process for cleaning post-etch fluorocarbon residues based on reductive radical ion chemistry has been developed and modified for use in semiconductor processing. Conventional liquid cleaning processes or oxidative processes may be incompatible with emerging low-dielectric constant materials. X-ray photoelectron spectroscopy results …

us (code pays fourni par la source)