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Nagahiro Abe, Takuma Nishimura, Hikaru Watanabe, Ichiro Somada et autres
The first feature of these modules is the adaptation of the redistribution layer (RDL) process, which has achieved high-density and high-precision antennas in packages (AiP) integrated with RFIC. The second feature is double patch antennas with cavities for high-gain antennas. We designed …
us (code pays fourni par la source)
Takuma Nishimura, Takumi Nagamine, Ryo Sakamaki, Yuanfeng She et autres
This study presents an antenna incorporated with a radiofrequency integrated circuit for the Sub-THz band. The proposed structure features a cavity-backed dual patch antenna fabricated using a redistribution layer and thick copper layer substrate processes, resulting in an antenna with high gain …
jp (code pays fourni par la source)
Takuma Nishimura, Hidenori Ishibashi, Yutaro Yamaguchi, Takumi Nagamine et autres
We propose a low-loss, high-heat dissipative fourway power combiner that can be applied to multiple monolithic microwave integrated circuits (MMIC) with flip-chip bonding for high power solid-state power amplifier modules. This structure mainly consists of a two-way power combiner comprising an air-filled …
jp (code pays fourni par la source)
Makoto Kimura, Yukinobu Tarui, Hironobu Shibata, Eigo Kuwata et autres
This paper describes a tile-type high-transmit-power TR module in order to realize a low-profile AESA (active electronically scanned array) radars. The TR module is based on a newly developed multichip packaging technology featuring top-surface waste heat structure with a flip-chip mounting and …
jp (code pays fourni par la source)
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