Aller au contenu principal
Accès ouvert déclaré 2026 article

Low-Cost Laser Decapsulation of Wire-Bonded Memory Packages with Dual Thermal Gating for Forensic Data Preservation

0Citations signalées, ce qui n’est pas une note de qualité
0Institutions déclarées
0Pays d’affiliation déclarés

Le résumé fourni par la source

Chip-off examination remains the method of last resort in digital forensics, applied when a device is locked, damaged or non-responsive, and it is the only route to data on many embedded targets such as vehicle event recorders and dashcams. The dominant removal technique is thermal reflow at approximately 360°C, and this is destructive to the evidence it recovers: charge leakage from flash memory is Arrhenius in temperature, so two minutes at 250°C consumes retention equivalent to centuries of room-temperature storage. This work develops a lower-temperature alternative using a consumer-grade 455 nm diode laser costing a small fraction of industrial equipment, together with an open-source browser-based tool that predicts thermal behaviour and gates recipes against two independent safety limits: wire-bond intermetallic damage and charge-retention loss. A finite element campaign in COMSOL Multiphysics characterised an eMMC package under a six-pass recipe. Two structural findings emerged. The bond-plane bulk temperature proved independent of remaining encapsulant thickness, because in quasi-steady state all absorbed power crosses the bond plane at fixed loop height regardless of the cap above it, which places the entire pass-to-pass risk in the per-pulse transient. Resolving finite spot size rather than assuming a one-dimensional heat source changed the predicted bond temperature from 181 to 272°C, which would condemn the process, to 94 to 139°C, which clears it. The campaign also identified two compensating errors in the tool's own analytical gate, which was corrected against the simulation. A single bench measurement, of laser spot size, returned 0.08 mm and satisfied a criterion recorded in advance. The wider bench validation programme is specified in full but was not executed, so the thermal model retains unverified status and all thermal figures reported are predictions rather than measurements. The claim advanced is one of data preservation, which is independent of encryption because charge leakage flips physical cells regardless of their contents.

Ce résumé expose les affirmations des auteurs. BNTIC ne l’interprète pas comme une validation indépendante des résultats.

Le contrôle bibliographique ouvert

DOI retrouvé dans Crossref DOI retrouvé ; titre concordant.

Titre Crossref
Low-Cost Laser Decapsulation of Wire-Bonded Memory Packages with Dual Thermal Gating for Forensic Data Preservation
Date Crossref
15/09/2026
Éditeur
Science Publishing Group
Type
journal-article

Ce recoupement confirme des métadonnées liées au DOI. Il ne confirme ni la méthode ni les conclusions de l’étude, et il ne compte pas comme une seconde source scientifique indépendante.

Les sujets associés

Physical Unclonable Functions (PUFs) and Hardware SecurityIntegrated Circuits and Semiconductor Failure AnalysisOcular and Laser Science Research

BNTIC News n’est pas le producteur de ces données. Les publications sont interrogées à la demande dans Crossref, OpenAIRE, DOAJ, Europe PMC, HAL, DataCite, AfricArXiv, ROR et la Banque mondiale, sans clé d’accès. OpenAlex reste optionnel. Aucun service payant n’est nécessaire et aucune donnée externe n’est enregistrée en base. Consulter les sources et leurs limites.