A Norbornene‐Networked Epoxy System Featuring Enhanced Thermal and Dielectric Performance as Advanced Electronic Materials

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ABSTRACT The escalating requirements of high‐frequency wireless communication and advanced semiconductor packaging necessitate the development of polymeric materials with superior thermal stability and low dielectric loss. In this work, we present the development of a norbornene (NB)‐derived epoxy system, synthesized using 5‐Ethylidene‐2‐norbornene (ENB) and phenol as the key staring materials. The resulted ENB‐phenol diglycidyl ether (ENBDE) was then cured with conventional commercial bisphenol‐A (BPA) diglycidyl ether (DGEBA) epoxy resin at various ratios (ENBDE‐DGEBA). Owing to the intrinsically rigid, low‐polarity cyclic structure of NB, the introduction of ENBDE into the DGEBA results in the thermosets with significantly improved thermal resistance (glass‐transition temperatures exceeding 230°C), excellent thermo‐oxidative stability, and exceptionally decreased dielectric loss (~0.0064 at 10 GHz). These standalone properties, combined with favorable moisture resistance and good mechanical property, identify this newly designed ENBDE polymer can be used as a highly promising electronic material for next‐generation high‐frequency and high‐speed electronic applications.

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