Resolving the strength-processing trade-off: Construction of novel polybenzimidazole-based semi-interpenetrating network photosensitive resins via thiol-ene click chemistry
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The growing demand for photopolymerized products across various industries has intensified the need to develop photosensitive resins that combine high mechanical strength with ease of processing. In this study, Poly(ether-benzimidazole) (OPBI) and allylated polybenzimidazole (AOPBI) were synthesized from commercially available 3,3′-diaminobenzidine and 4,4′-dicarboxydiphenyl ether. By tuning the molar ratio of OPBI to AOPBI and employing pentaerythritol tetrakis (3-mercaptopropionate) (PETMP) as a crosslinker, a novel semi-interpenetrating network (semi-IPN) photosensitive resin was successfully fabricated via thiol–ene click chemistry. Both OPBI and AOPBI exhibited good solubility in polar aprotic solvents. At an OPBI content of 80 wt%, the photocured resin demonstrated exceptional mechanical properties, including a tensile strength of 170.7 MPa, a Young's modulus of 3 GPa, and a yield strength of 136 MPa, along with notable thermal resistance in air (T d5% = 396 °C). The presence of flexible ether linkages and polar imidazole rings in the poly(ether-benzimidazole) backbone endows the material with excellent solution processability. The outstanding mechanical performance is attributed to the synergistic effect of hydrogen-bonding interactions among PBI macromolecules and the robust three-dimensional crosslinked network within the semi-interpenetrating polymer networks (Semi-IPNs) architecture. This work establishes an optimal balance between mechanical robustness and processability, offering a viable strategy for designing high-performance polymeric materials suitable for extreme service conditions. The developed resin shows promising potential for applications in precision additive manufacturing, aerospace, military equipment, and other advanced technological fields.
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DOI retrouvé dans Crossref DOI retrouvé ; titre concordant.
- Titre Crossref
- Resolving the strength-processing trade-off: Construction of novel polybenzimidazole-based semi-interpenetrating network photosensitive resins via thiol-ene click chemistry
- Date Crossref
- 01/09/2026
- Éditeur
- Elsevier BV
- Type
- journal-article
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