SiC MiniPIX Timepix3 detectors for beam characterization and UHDR monitoring in particle therapy

Le résumé fourni par la source

Abstract A hybrid semiconductor detector consisting of a 65 μm thick 4H-SiC sensor bump-bonded to a Timepix3 ASIC was used to characterize carbon- and helium-ion beams (up to 402 MeV/u). Compared to a 500 μm thick Si sensor, the SiC detector shows an 87 ± 3% reduction in pixel occupancy for 290 MeV/u carbon, preventing ToT saturation while maintaining tracking properties; this corresponds to ≈7.7× higher tolerable particle flux at matched settings. For helium, mean cluster sizes of 1.0 px (SiC) versus 5.0 px (Si) imply ∼80% lower occupancy and ≈5× higher flux headroom. For ultra-high dose-rate (UHDR/FLASH) applications, out-of-field monitoring of 226 MeV pencil-beam scanning deliveries (169 spots, of ∼2 ms duration) achieved 100% spots detection efficiency and a linear dose-rate response across 100–500 nA, with sensitivity down to 10 mGy/s. Overall, SiC-based MiniPIX-Timepix3 enables compact, non-invasive, particle-resolved beam monitoring with improved dynamic-range utilization and scalable flux tolerance, supporting advanced in-room QA across clinical and UHDR conditions.

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