A Fully Integrated Stimulator With High Electrode Voltage Using Hybrid Dynamic Bulk Biasing Technique and Charge-Pump-Like Control Technique in a Bulk CMOS Technology

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This paper presents a fully integrated NMOS stimulator using a hybrid dynamic bulk biasing technique (HDBT) and a charge-pump-like control technique (CCT) in a 180-nm bulk CMOS technology. HDBT integrates terminal-voltage-dependent and logic dynamic bulk biasing to set the bulk bias voltage according to the electrode voltage. CCT adds a DC voltage to the gate terminal through a diode and capacitor to help turn on the NMOS transistor. It helps turn off the transistor by shorting the source and gate terminals together and applying two diodes across the drain and source terminals. To achieve an electrode voltage higher than the breakdown voltage of substrate diode ($V_{\mathrm {BD}}$) with an independent power supply, a high voltage tolerant switch is proposed with HDBT and CCT. A high voltage interface is also proposed, utilizing the capacitor adaptive biasing, to overcome the limitation of$V_{\mathrm {BD}}$between the high and low voltage domains and to accommodate the variation of electrode voltage. Fabricated in a 180-nm standard CMOS technology, the stimulator achieves a maximum electrode voltage ($V_{\mathrm {E,MAX}}$) of 18.74V under a 3.3-V supply, with a highest$V_{\mathrm {E,MAX}}$/$V_{\mathrm {BD}}$ratio of 1.27 than state-of-the-art stimulators, including non-standard technology designs. In a continuous output test mode over 10million cycles, the variation of$V_{\mathrm {E,MAX}}$is less than 150mV. The measured maximum residual voltage on the capacitor is 13.55mV.

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