Fault Diagnosis and Health Monitoring Method for Semiconductor Manufacturing Equipment Based on Deep Learning and Subspace Transfer

Le résumé fourni par la source

Semiconductor manufacturing equipment such as vacuum pumps, wafer handling mechanisms, etching machines, and deposition systems operates for a long time under high vacuum, high temperature, strong electromagnetic, and high-precision continuous production environments. Its reliability is directly related to the yield and stability of the production line. During equipment operation, the fault signals are often weak, the noise is strong, and the working conditions are variable, so traditional methods are difficult to achieve high-precision recognition. To solve this problem, this paper proposes a fault diagnosis and health monitoring method for semiconductor manufacturing equipment based on deep learning and subspace transfer. Firstly, considering the cyclostationary characteristics of the operating signals of key equipment, the cyclic spectral analysis technology is used to obtain the cyclic spectral coherence map, which effectively reveals the feature differences under different health states. Then, a deep fault diagnosis model based on the convolutional neural network (CNN) is constructed to extract deep feature representations. Furthermore, the subspace transfer learning technology is introduced, and group normalization and correlation alignment unsupervised adaptation layers are designed to achieve automatic alignment and enhancement of the statistical characteristics of deep features between the source domain and the target domain, which effectively improves the generalization and adaptability of the model. Finally, simulation experiments based on the public bearing dataset verify that the proposed method has strong feature representation ability and high classification accuracy under different working conditions and different loads. Because the key components and experimental scenarios of semiconductor manufacturing equipment have similar signal characteristics, this method can be directly transferred to the early fault diagnosis and health monitoring of semiconductor production line equipment, which has important engineering application value.

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