Thermal Interface Material Solutions for Telecom Components

Le résumé fourni par la source

ABSTRACT The electronics industry continues to advance towards increasing processing power while moving towards smaller, more compact modules. This results in an increase in heat generation. Thermally conductive material technology continues to advance to meet the growing need for heat dissipation. The choices in materials often seem as varied as the applications. A discussion of some typical applications for thermally conductive materials is necessary to choose the correct material. It is important to start from the basics on what makes a thermally conductive material. Each application has critical material needs that need to be addressed before a solution can be addressed. Discussions will encompass the unique advantages that wet silicone chemistry can deliver. Future market needs will be presented along with a brief technology roadmap to get there. Through addressing the following areas: important factors in material formulation, key properties to consider when choosing a material, application considerations and examining the available technologies, choosing the correct material for an application is possible.

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