Study on “Top-Down” System's EMC Design Flow with Multi-EDA Simulation Software

Le résumé fourni par la source

The development of modern electronic information technology has accelerated the application and promotion of electronic information systems in multiple fields. On various platforms such as modern airplanes, cars, and ships, a large number of electronic devices are concentrated in small spaces. These electronic devices can generate electromagnetic interference (EMI) during operation, affecting the normal operation of other devices. To overcome the shortcomings of traditional electromagnetic compatibility analysis and design methods mentioned above, this paper proposed a “top-down” system's electromagnetic compatibility (EMC) design flow from system level, device level and cable level to PCB level. It mainly relies on the multi-EDA simulation technology and proposes indicator requirements at the system level, and seamlessly interacts simulation information with the next layer. An example of multi-electric system EMC simulation is provided to demonstrate the validity of “top-down” system's EMC design flow. In this case, the circuits and 3D electromagnetic field models are established and simulated through field-circuit coupling simulation, and the comparison between simulation data and measured values indicates that the calculation results of the simulation method used are highly consistent with the actual test results. This implies that the “top-down” system's EMC design flow with multi-EDA simulation tools is competitive candidate for EMC design and EMI analysis of various system level EMC simulation problems.

Ce résumé expose les affirmations des auteurs. BNTIC ne l’interprète pas comme une validation indépendante des résultats.