Performance study of PCB thermal vias based on femtosecond laser processing

Résumé fourni par la source

Abstract To enhance the thermal management performance of printed circuit boards, a systematic investigation was conducted focusing on thermal vias. A mathematical model for the vertical thermal resistance of thermal vias was first established, and the effects of via diameter and spacing on thermal resistance were analyzed. Finite element simulations were then performed to evaluate thermal behavior under different structural parameters and to validate the proposed model. Subsequently, thermal vias were fabricated in flame retardant 4 substrates using femtosecond laser processing, followed by the formation of metal heat-conducting channels through an electroless copper plating process. Thermal performance tests were carried out to assess the heat dissipation capability. The results demonstrate that optimizing the via structure can significantly reduce thermal resistance and enhance heat dissipation efficiency, offering theoretical support and practical guidance for the thermal management of high-power electronic devices.

Ce résumé expose les affirmations des auteurs. BNTIC ne l’interprète pas comme une validation indépendante des résultats.