Development of Ag Nanotwinned Film Coated Pre-Formed Silver Sintered Sheets for the Die Bonding of SiC Chips with DBC Ceramic Substrates

Résumé fourni par la source

The high surface diffusivity of (111)- preferred orientation nanotwinned films has been suggested to apply for the low temperature direct bonding of chip to chip in 3D-IC advanced packages. The beneficial effects have also been reported for the Ag sintered die bonding of SiC power modules. In this research, an innovative pre-formed Ag sintered sheets with and without surface deposition of nanotwinned films are proposed for the die bonding of SiC. It shows that the bonding layer porosity decreased from 8.1% to 0.7% as the sintered material changed from traditional Ag paste to pre-formed Ag sheets in the case of die bonding of nanotwinned film metallized SiC chips with DBC alumina substrates. Another example showed that porosities of 3.7% and 4.6% were achieved for the die bonding of SiC/DBC power modules using Ag nanotwinned films coated on the smooth and rough surfaces of the pre-formed Ag sintered sheets, respectively, much preferer to the value of 26.8% for the conventional Ag sintered die bonding without employment of nano-twinned films.

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