Analysis of Thermal Characteristics According to Semiconductor Package Structure and Application

Le résumé fourni par la source

A semiconductor packaging process is necessary to connect the semiconductor components to the applications that use them and the silicon chip. The chip is produced in various types of packages to meet the application requirements, and differences in the structure and materials of these packages can affect the thermal characteristics of the chip. The heat generated by the chip first dissipates through the package and then transfers system. To enhance the efficiency of the heat dissipation system, it is crucial to understand the thermal characteristics of the package, where the primary heat diffusion occurs. This paper analyzes and compares the thermal characteristics of different packages used in mobile Application Processor (AP), including stacked Package-On-Package (PoP), Flip-Chip Ball Grid Array (fcBGA), and fcBGA with a Heatslug (fcBGAH) used in automotive and datacenter applications. Typically, the thermal resistance value of a package is used as an indicator of its intrinsic thermal characteristics. However, the thermal resistance parameter varies not only based on the package structure but also depending on the external thermal environment of the system in which it is mounted, as well as the floorplan design of the heat source. Therefore, the thermal resistance value does not solely represent the package structure but serves as a comprehensive thermal characteristic indicator that includes specific environments and scenarios. This paper explores a method for defining the structural and material thermal characteristics of the package. It defines the inherent thermal characteristics of each package in terms of its vertical heat transfer rate and horizontal heat diffusion rate. Additionally, the paper also analyzes the sensitivity of the thermal characteristics of each package type to changes in the external heat dissipation environment.

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