Research on advanced manufacturing production models for high-reliability hybrid integrated circuits

Le résumé fourni par la source

Highly reliable hybrid integrated circuits (ICs) are widely used in aerospace, weapons, and military industries due to their small size, high density, and high reliability. These ICs are usually assembled using all-metal hermetic packages and thick-film substrates. Hybrid integrated circuits have traditionally been characterized by multi-species, small-batch production with significant manual processing. In recent years, with the gradual increase in market demand for hybrid integrated circuits, production lines have increasingly moved toward automation and intelligence, thereby creating new requirements for production methodologies. In this study, multiple process steps in the assembly of hybrid integrated circuits were investigated, including soldering, bonding, and lead bonding. By optimizing the sequence of these different process steps, the most suitable assembly mode for automated production of hybrid integrated circuits was determined. Results indicate that the production mode most applicable to advanced manufacturing of high-reliability hybrid integrated circuits should follow the sequence of: reflow soldering, adhesive bonding, lead bonding, and manual soldering. Production lines implementing this mode can achieve an automation ratio exceeding 80%, with products meeting the requirements of class H in GJB2438B standard.

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