Evolution of the microstructure and mechanical properties of Cu strips manufactured by a novel single-step drawing and progressive rolling process

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This study develops a novel "single-step drawing and multi-stage rolling" composite process for manufacturing high-performance ultrathin copper (Cu) strips, systematically exploring microstructure evolution and mechanical property regulation mechanisms. Finite element modeling (FEM) conducted via ABAQUS revealed pronounced spatiotemporal heterogeneity in stress-strain field distributions, characterized by a marked escalation in longitudinal (x-axis) tensile stress during the secondary and tertiary rolling phases, whereas transverse (y-axis) compressive stresses exhibited progressive stabilization. Quantitative microstructural characterization evidenced a monotonic reduction in grain size from 22.88 μm (as-received Cu wire) to 9.31 μm (post-deformation), attributable to dynamic recrystallization mechanisms. Notably, post-annealing microstructural evolution analysis identified abnormal grain growth as the dominant factor governing the strength degradation in incremental differential speed rolling and recrystallization annealed (IDRRRA) specimens Comparative mechanical testing showed that the IDRRRA-sample exhibited lower tensile yield strength (TYS: 85.39 MPa) and ultimate tensile strength (UTS: 403.65 MPa) but superior elongation (58.1%) compared to I-sample. Visco-plastic self-consistent (VPSC) simulations revealed that although both alloys exhibited {111}<110> slip-dominated deformation during tension, the {111}<112> twinning in the IDRRRA specimen was delayed during the later stages of tensile deformation compared to I-sample.

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