A ${4} \times \text{112-Gb}/\mathrm{s}$, 3.51-pJ/Bit Monolithically Integrated Silicon-Photonic Transceiver for High-Density Co-Packaged Optics

Le résumé fourni par la source

A$4 \times 112-\text{Gb} / \mathrm{s}$Si-photonic (SiPh) transceiver (O-TRX) for co-packaged optics (CPO) is presented in$45-\text{nm}$SOI CMOS. By monolithically integrating electronic circuits and photonic devices on one chip, high bandwidth density and high power efficiency is achieved. A high-swing open-drain driver is codesigned with the traveling-wave Mach-Zehnder Modulator (MZM) to reach high speed at low power. A compact-size inverter-based trans-impedance amplifier (TIA) is cooptimized with the photodetector (PD). Multi-node inductive peaking is employed to extend bandwidth while maintaining a linear phase delay. The O-TRX loopback is demonstrated at$112-\text{Gb} / \mathrm{s} /$lane under PAM-4 modulation. Measurement results show the OTX achieves$224-\text{Gb} / \mathrm{s} / \text{mm}$bandwidth density with$2.36-\text{pJ} /$bit power efficiency, while the ORX attains$299 \text{Gb} / \mathrm{s} / \text{mm}$density with$1.15-\text{pJ} /$bit efficiency.

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