Hydrophobic Barrier for Controlled Epoxy Keep-Out-Zone in Flip Chip Assembly

Le résumé fourni par la source

An advanced formulation of hydrophobic barrier is developed, enhancing the control of the keep-out-zone for epoxy underfill. The new formulation addresses previous limitations by being compatible with both auger and jet dispensing methods, which allows for the creation of finer lines below$100 \mu \mathrm{m}$and the ability to stack the material to heights greater than 1 mm. Notably, the formulation is over 200 % more sensitive to ultraviolet light, requiring a lower dose for curing and thus accelerating the manufacturing process. The improvement also offers better visual contrast to aid in inspection and maintains its barrier properties by preventing resin bleeding for over 70 hours without UV curing, for a substrate with appropriate surface hydrophilicity. This is achieved despite a significant reduction in viscosity by over 50 %. It supports precise dispensing within tight spaces, enabling new applications such as under-die barriers, barriers for intricate cavities and recesses, and the encapsulation of die-side components or dummy bumps. This breakthrough in barrier technology not only streamlines manufacturing processes but also broadens the scope for creative and innovative design solutions in the field of semiconductor packaging.

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