Influences of Chip Shape on Scaling in Chip-on-Wafer Hybrid Bonding

Le résumé fourni par la source

This study investigated the influences of chip warpage and thickness on scaling in chip-on-wafer hybrid bonding. Scaling, a key bonding misalignment parameter, depends on the bonding process and substrate properties. Effective control of scaling is crucial for interconnecting Cu pads with finer pitch. Scaling was induced by pre-stretching the incoming chip prior to bonding and during bond wave propagation. A warped chip deformed under the film stress, thereby influencing scaling. Thinner chips exhibited greater stretch, resulting in a more significant impact. In addition, deformation occurred during bond wave propagation when bonding with a round bonding head, which also influenced scaling. The extent of deformation was observed to depend on the chip thickness.

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