Fabrication Optimization and Reliability Study of Hyper RDL (HRDL) Interposer for Advanced Packaging and Heterogeneous Integration

Le résumé fourni par la source

Owing to warpage issues for multi-layer interposer, the device performance is limited by the I/O density of the interposer. The HRDL interposer, developed using a low-temperature hybrid bonding and layer transfer technique, significantly improves warpage issues and increases I/O density compared to traditional RDL interposers. This study aims to minimize the thermal budget of the HRDL interposer by adjusting the appropriate burning spot overlap, which is critical to the reliability of HRDL. Additionally, the third layer of HRDL is successfully transferred onto the previous structure, as confirmed by OM and SEM observations. Furthermore, reliability tests, including TCT and µHAST, are performed to verify the RDL interposer. The variation in resistance remains below 10%, demonstrating excellent electrical reliability and thermal stability of the HRDL process for multilayer RDL interposer fabrication.

Ce résumé expose les affirmations des auteurs. BNTIC ne l’interprète pas comme une validation indépendante des résultats.