Industry 4.0

Le résumé fourni par la source

The goal of this chapter is to offer an outline of Industry 4.0 issues and challenges that arise during manufacturing and testing at the device level, and how we should design and execute potential business entities. The concept of Industry 4.0 has become incredibly valuable, with academics, consultants, and enterprises debating and researching it. As we inched closer to the 4th Industrial Revolution, variabilities such as analysis, programming, visualization, optimization, and networking were embedded into physical structures to assist emerging new automated systems. MEMS (microelectromechanical system) has evolved as a cutting-edge technology in Industry 4.0, opening up new possibilities for physical, chemical, and biological sensor and actuator applications. Its mechanical failures include mechanical fracture (shock, mechanical interference disorder, corrosion), stiction (residual stress, electrostatic charging), wear (surface fatigue, abrasion, adhesion), and creep and fatigue (thermal stress, intrinsic stress). There are also some electrical failures such as oxidation, electro-migration, ESD, strong electric field, and contamination (intrinsic crystal development, environmental usage). As a result, testing of these systems is required both at the device level and at various stages throughout the process to validate the device’s performance metrics. The intricate design of the device to be evaluated prompts sophistication in the test procedure, which raises development costs and consequently impacts on device costs.

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