Micromachined Ceramic-based Chipless LC Resonator for High-Temperature Wireless Sensing Application in Harsh Environments
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Le résumé fourni par la source
Abstract The primary objective of this work was the fabrication and testing of a wireless LC resonator based on micro-patterned electroceramic materials for the monitoring of high-temperature systems. The two-dimensional planar LC resonator sensors were designed and simulated using ANSYS Maxwell software, and these sensors were then fabricated from electrically conductive La2NiO4/Al2O3 particulate inks. The patterning and deposition of the ink were completed using a novel micro-casting process onto Al2O3 ceramic substrates, and the final pattern was bonded onto the substrate at 1200oC for 2 h. The final patterned materials were characterized using X-ray diffraction (XRD), scanning electron microscope (SEM), and four-point conductivity to characterize the phase and microstructure development, and the resultant electrical conductivity (at 500-1200oC), respectively. The frequency shift with respect to temperature was measured, which is directly related to changes in the sensor’s dielectric permittivity and pattern dimensions. The sensors were characterized at 500 – 1000oC in an ambient atmosphere with an RF signal ranging from 10 – 80 MHz at 175 kHz·s-1 sweep rate. A new robust and adaptive signal processing approach was introduced to increase the degree of freedom for analyzing the wireless sensors.
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Le contrôle bibliographique ouvert
DOI retrouvé dans Crossref DOI retrouvé ; titre concordant.
- Titre Crossref
- Micromachined Ceramic-based Chipless LC Resonator for High-Temperature Wireless Sensing Application in Harsh Environments
- Date Crossref
- 27/05/2020
- Éditeur
- Springer Science and Business Media LLC
- Type
- posted-content
Ce recoupement confirme des métadonnées liées au DOI. Il ne confirme ni la méthode ni les conclusions de l’étude, et il ne compte pas comme une seconde source scientifique indépendante.
Où se fait cette recherche
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West Virginia University Department of Mechanical and Aerospace Engineering pays non établi dans la noticeUniversité ou école supérieure
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ORCID pays non établi dans la noticeOrganisation à but non lucratif
Department of Mechanical and Aerospace Engineering — West Virginia University et ORCID.
Une affiliation ne permet pas de déduire la nationalité d’un auteur.