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Accès ouvert déclaré 2021 article

New Approaches for Protecting the Computer and Electronic Devices Against Heat Dissipation

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5Institutions déclarées
4Pays d’affiliation déclarés

Résumé fourni par la source

This research is based on an experimental investigation of four different types of heatsinks, which was backed up by a simulation analysis. The goal of this study is to determine the relevance of various heatsink forms and sizes, as well as to enhance the best situation. The cooling strength of these heatsinks was next investigated experimentally and then numerically, while adjusting in the same initial conditions, finding in principle that the experimental and numerical results agree, with a contrast ratio of less than 10.24%. As a consequence, we concluded that the coolant D3, which is circular and has a heat resistance of 0.582 K. W-1, is stronger than the D2 compact circular cooler, which has a resistance of 0.590 K. W-1. These two varieties were far superior to the regular D1 heatsink, which first debuted in the early days of computers and had a resistance of 0.595 K. W-1, but the best was the mixed engineering D4 heatsink, which had a heat resistance of 0.50 K. W-1. Changes were also made to the geometry of the best heatsink D4, by varying its heights (28, 23, 19, and 15 mm). The heat resistors were arranged in sequence (0.50, 0.560, 0.568, 0.586 kg/s), and the weights were arranger in order (3.12N, 2.56N, 2.11N and 1.67N).

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DOI retrouvé dans Crossref DOI retrouvé ; titre concordant.

Titre Crossref
New Approaches for Protecting the Computer and Electronic Devices Against Heat Dissipation
Date Crossref
30/06/2021
Éditeur
International Information and Engineering Technology Association
Type
journal-article

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Institutions déclarées

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Sujets associés

Heat Transfer and Optimization

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