A Short Review on the Stress Field of a Screw Dislocation in a Thin Film – Substrate

Le résumé fourni par la source

An analytical Fourier series analysis of the elastic field of a misfit dislocations along a thin film-substrate interface is proposed in the context of a plane strain. When the period is sufficiently large, this solution tends assymptotically towards that of an isolated dislocation in the thin film substrate system. Numerical applications are illustrated to evaluate the effect of elastic properties of the materials used as well as the effect of the film thickness and the position of the dislocation in the substrate.

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