Thermal cycling reliability of hybrid pixel sensor modules for the ATLAS High Granularity Timing Detector
Y Li, A. Aboulhorma, M. Ait Tamlihat, H. M. Alfanda et autres
Abstract The reliability of bump connection structures has become a critical aspect of future silicon detectors for particle physics. The High Granularity Timing Detector (HGTD) for the ATLAS experiment at the High-Luminosity Large Hadron Collider will require 8032 hybrid pixel sensor modules, …
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