Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
T. Nogami, Sarah Lane, Masanaga Fukasawa, K. Ida et autres
This paper discusses low-k/copper integration schemes which has been in production in the 90 nm node, have been developed in the 65 nm node, and should be taken in the 45 nm node. While our baseline 65 nm BEOL process has been …
us (code pays fourni par la source)
0 citations
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE